Cooler Master HTK-002 thermally conductive compounds are
grease-like silicone materials, heavily filled with heat conductive metal
oxides. This combination promotes high thermal conductivity, low bleed and
high-temperature stability. These compounds resist changes in consistency at
temperatures up to 177°C (350°F), maintaining a positive heat sink seal to
improve heat transfer from the electronic device to the heat sink or chassis,
thereby, increasing the overall efficiency of the device.
Suitable for CPU, chipsets on Mainboard, VGA card, etc.
Easy to use.
Zif Socket Templates ensure correct applying area with various CPU socket types.
Produces an even layer when using applicator.
Dielectric.
Wide range of application temperature.
Form 1 Part
Color White
Viscosity/Flowability Nonflowing
Specific Gravity (cured) 2.37
Shelf Life 24 months from DOM
Dielectric Constant 4.4 at 100k Hz
Volume Resistivity 5.0 x 1015
Dissipation Factor 0.02 at 100k Hz
Dielectric Strength 550 volts/mil; 21.7 kV/mm
Thermal Conductivity 0.8 watts/meter- °C
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